Consumer eUICC products available in MFF2 solder package

Following our successful sysmocom consumer eUICC products successfully in removable plastic-card (2FF/3FF/4FF) form-factor, we are happy to announce the availability of the same product in the MFF2 solder-type package.

When we started to sell the consumer eUICC, we assumed it is special/unusual to have them in removable form-factor. And indeed, there are few suppliers offering such products on the market. However, based on various customer inquiries we are now following-up with the solder-type MFF2 package.

Our market analysis has shown that while SGP.02 M2M eUICC in MFF2 package can be sourced from many electronics distributors, the SGP.22 Consumer eUICC in MFF2 package could not be sourced easily anywhere, particularly not from stock and in low quantities. Our product aims to clsoe that gap and enables manufacturers to build embedded products with soldered / non-removal eUICCs for the GSMA Consumer eSIM RSP.

Sample quantities of 10 eUICCs each are available for self-checkout from our webshop.

Larger quantities at quantity pricing can be sourced via inquiries to sales@sysmocom.de.